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电子元件空气冷却的当代观点

ISBN: 978-1-56700-304-8

电子元件空气冷却的当代观点

Mark E. Steinke
Mechanical Engineering Department, Rochester Institute of Technology, Rochester, New York 14623, USA

描述

In this book the author discusses the roots of electronics cooling and how air cooling is still dominant over water cooling and will remain so for the near term. For over a century now, this area has been ripe with active research in many disciplines spanning heat transfer, thermodynamics, materials science, and structural engineering. Perhaps the most appealing feature of the electronics cooling field is the very multidisciplinary nature of the challenges being overcome. Unlike some other areas, the electronics cooling system designer must have knowledge of several disciplines to design and deliver the most optimal electronics cooling solution. In the future there will be a new roadmap laid out before us and there may be a time liquid cooling is required in mainstream computing. However, I see many current years where air cooling will play a critical role and must be improved to meet future needs.



91 pages, © 2012