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Transport Phenomena in Thermal Engineering. Volume 2

ISBN:
1-56700-015-0 (Print)

NATURAL CONVECTION HEAT TRANSFER FROM ELECTRONIC COMPONENTS LOCATED IN AN ENCLOSURE

M. H. Esteki
School of Mechanical & Manufacturing Engineering, The University of New South Wales, Kensington, Australia

John A. Reizes
University of Technology; and School of Mechanical and Manufacturing Engineering, University of New South Wales, Sydney, NSW 2052, Australia

Masud Behnia
School of Mechanical and Manufacturing Engineering, University of New South Wales, Sydney 2052, Australia

Abstract

The problem of laminar natural convection cooling of electronic components located on a vertical substrate placed in a square enclosure filled with a fluid of Prandtl number equal to 0.71 corresponding to air is studied numerically. A commercially available general purpose CFD code, FLOW3D, was used to simulate the physical problem. Results have been obtained for a number of two dimensional geometries of realistic size conditions. The optional positions for the cooling of isothermal and constant heat flux plates are given.