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Transport Phenomena in Thermal Engineering. Volume 2

1-56700-015-0 (Print)


Michael J. Morgan
Aero Propulsion and Power Directorate, Wright Laboratory, Wright-Patterson AFB, OH 45433, USA

Won Soon Chang
Wright Laboratory, Wright-Patterson At Force Base, OH 45433-6563, USA

Martin R. Pais
Cudo Technologies, Ltd., Lexington, KY 40506

Louis C. Chow
Department of Mechanical Engineering, University of Kentucky, Lexington, KY 40506


The advent of LSI/VLSI systems, laser diode power optics and other advanced electronic systems in miniaturized, compact form have resulted in significant increases in heat flux density. The stringent temperature uniformity specifications on these systems demand innovative means of applying state-of-the art technology in enhancing heat removal.
Promising cooling techniques that will meet the future thermal control requirements for these electronic and optics packages are presented. These concepts involve the use of microchannel, droplet impingement, jet impingement, and flow boiling in straight or curved channels.