Boris V.
Kosoy D. N.
Nikitin ABSTRACT The problems of creation of miniaturized network thermal-control systems for cooling of electronic devices, characterized by high heat-flux densities are considered. We examine, as heat-transfer elements, micro heat pipes whose principle of action is based on a joint use of modern technologies of miniaturization of technical devices and a high efficiency of heat-mode supporting systems on the basis of two-phase heat-transfer loops. Known methods of modeling of micro heat pipes and unsolved problems are analyzed. A fractal approach to the design of networks made of heat-conduction elements, which predicts an increased efficacy of the thermal-control process, is proposed.
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