Journal of Enhanced Heat Transfer Theory and Application in High Performance Heat and Mass Transfer

ISSN for PRINT: 1065-5131

For Online Access

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2003, Volume10

Issue 2

126 pages

DOI: 10.1615/JEnhHeatTransf.v10.i2

Issue price - $138.00

Dr. Hiroshi Honda
Institute of Advanced Material Study, Kyushu University, Kasuga 816, Japan

H. Takamatsu
Institute of Advanced Material Study, Kyushu University, Kasuga, Fukuoka 816-8580, Japan

J. J. Wei
Interdisciplinary Graduate School of Engineering Sciences, Kyushu University, Kasuga, Fukuoka 816-8580, Japan

Experiments were conducted to study the effect of the size of micro-pin fin on boiling heat transfer from a silicon chip immersed in a pool of degassed or gas-dissolved FC-72. Four kinds of micro-pin fins with dimensions of 10 × 60, 20 × 60, 30 × 60, and 50 × 60 μm² (thickness × height) were fabricated on the surface of a square silicon chip with dimensions of 10 × 10 × 0.5 mm³ using the dry etching technique. Experiments were conducted at liquid subcooling of 0, 3, 25, and 45 K under atmospheric conditions. The results were compared with those for a smooth chip and previously developed enhanced surfaces. The micro-pin-finned chips showed a considerable heat transfer enhancement over the smooth chip in the nucleate boiling region. The boiling curve showed a steep increase in heat flux with increasing wall superheat. For the micro-pin-finned chips, the critical heat flux was 1.9–2.3 times as large as for the smooth chip, and the wall temperature at the critical heat flux point was lower than the upper limit for the reliable operation of large-scale integration (LSI) chips (= 85 °C). While the wall superheat at boiling incipience was strongly dependent on the dissolved gas content, it was little affected by the liquid subcooling.

DOI: 10.1615/JEnhHeatTransf.v10.i2.70 Download article, 211-224 pages

Article price - $35.00

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