High Temperature Material Processes (An International Quarterly of High-Technology Plasma Processes) An International Journal

ISSN for PRINT: 1093-3611

For Online Access

Best Paper Award Selection - Editorial Board Site

2001, Volume5

Issue 2

152 pages

Issue price - $144.00

J. Stanco
Institute of Fluid-Flow Machinery, Polish Academy of Sciences, Fiszera 14, P.O. Box 621, 80-952 Gdansk, Poland

Helena Nowakowska
Institute of Fluid-Flow Machinery, Polish Academy of Sciences, Fiszera 14, P.O. Box 621, 80-952 Gdansk, Poland

Zenon Zakrzewski
Centre of Plasma and Laser Engineering, Institute of Fluid Flow Machinery, Polish Academy of Sciences, Fiszera 14, 80-231 Gdansk, Poland

M. Moisan
Groupe de physique des plasmas, Universite de Montreal, BP 6128, succursale Centre-ville, Montreal H3C 3J7, Quebec, Canada

The efficient adoption of microwave discharges at atmospheric pressure as sources of plasma for various industrial and scientific applications depends on the ability of controlling the plasma properties. This implies knowing the dependence of plasma parameters and their spatial distributions on the discharge conditions (electromagnetic field mode and frequency, nature, pressure and flow rate of the gas, geometry and size of the discharge setup) and the amount of microwave power delivered to the plasma. Proper modeling of the processes occurring in the plasma may provide such an information. This paper describes the work done in that domain over the last years by the authors and co-workers.
The investigations have mainly concerned traveling wave discharges and, specifically, surface-wave discharges. That has made it necessary to additionally study the wave propagation characteristics and include them in the modeling of the discharge plasmas. The approximation that has been used consists in solving separately the plasma maintenance equations and those describing the electromagnetic properties of the system analyzed, and subsequently merging the results. Further, we either assume a local thermodynamic equilibrium or adopt a two-temperature plasma model.

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