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High Temperature Material Processes (An International Quarterly of High-Technology Plasma Processes)

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High Temperature Material Processes (An International Quarterly of High-Technology Plasma Processes)
 
 

ISSN: 1093-3611 Print

ISSN: 1940-4360 Online

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click 'Save as...' here to save XML metadata   Year 2007, Volume 11 / Issue 4

DOI: 10.1615/HighTempMatProc.v11.i4

Pages: 161

DOI: 10.1615/HighTempMatProc.v11.i4.60 Article price - $35.00 Add to shopping cart

COMPREHENSIVE MODIFICATION OF SEMICONDUCTORS AND METALS PROVIDING NEW STRUCTURAL FEATURES OF SURFACE LAYERS SUBJECTED TO COMPRESSION PLASMA FLOWS


ABSTRACT

The priority results obtained with the use of compression plasma flows for substantial structural-phase modification of semiconductor and metal surfaces are presented. In particular, the formation of bulk (cylinder-like) regular submicron/ nanoscale structures on the silicon wafers, deposition of nanostructured metal coatings completely covering a surface including bulk structures, plasma-assisted mixing in the systems "coating-substrate" from various materials, and a deep doping of modified layer by atoms of the plasma-forming gas are reported.


pages 537-548


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