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International Journal for Multiscale Computational Engineering

 

ISSN for PRINT: 1543-1649

Institutional price:

$747.00

Issues per year:

6

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Best Paper Award Selection - Editorial Board Site

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2005, Volume3

Issue 1

  135 pages  

DOI: 10.1615/IntJMultCompEng.v3.i1   

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  • Review of Multiscale Simulation in Submicron Heat Transfer
  • Jayathi Y. Murthy
    School of Mechanical Engineering Purdue University, West Lafayette, IN 47907, USA

    Sreekant V. J. Narumanchi
    National Renewable Energy Laboratory MC 1633,1617 Cole Boulevard, Golden, CO 80401-3393

    Jose' A. Pascual-Gutierrez
    School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907

    Tianjiao Wang
    School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907

    Chunjian Ni
    School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907

    Sanjay R. Mathur
    Fluent Inc. 10 Cavendish Court, Lebanon, NH 03766, USA


    ABSTRACT

    Over the last decade, interest in the simulation of micro- and nanoscale heat transfer has lead to the development of a variety of models and numerical methods for phonon transport in semiconductors and dielectrics. These models span direct simulation using molecular dynamics, a range of models of varying fidelity based on the Boltzmann transport equation, as well as simpler hyperbolic extensions to the classical Fourier heat conduction equation. The paper reviews the basics of phonon transport in crystals, available models for phonon transport, as well as numerical methods for solving the equations resulting from these models. Recommendations are made for future work.

    DOI: 10.1615/IntJMultCompEng.v3.i1.20

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