Annual Reviews of Heat Transfer

ISSN 1049-0787

Year 1997

• 8

328 pages

Volume price - $141.00

Wataru Nakayama
Department of Mechanical & Intelligent Systems Engineering, Tokyo Institute of Technology, 2-12-1 Oh-Okayama, Meguro-ku Tokyo 152, Japan

The increasing importance of conjugate heat transfer in electronic equipment is explained in light of the requirements on the compactness of system volume and the hardware evolution that strengthens thermal bonding between the heat source and the substrate. A survey of literature is presented that attempts to illuminate certain physical insights gained from studies on different physical models. Two major consequences of substrate conduction are described. One is the development of thermal boundary layer upstream of the heat source that works to reduce the direct heat transfer from the source to the coolant. The other is the increase of heat transfer area provided on the heat-source side and the back side of the substrate. On most of the physical models the beneficial effect of substrate conduction prevails, and enhancement of heat transfer is particularly large in laminar flow environment. An approach based on the concept of adiabatic wall temperature and adiabatic heat transfer coefficient is proposed to reduce the requirement on experimental and computational resources in dealing with problems involving complex coolant flow patterns. In view of the rapid pace of technological development the heat transfer researcher has to keep abreast of the evolution of geometric morphology of electronic components and systems to produce useful information for the industry designer.

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