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Annual Reviews of Heat Transfer

 

ISSN 1049-0787

Individual price:

$175.00 (Must be sent to your home address)
You can order single issue or individual article. To purchase a single issue or an individual article as well as to view tables of contents and abstracts click on issue number.

Institutional price:

$349.00

Volumes per year:

various

For Online Access


Year 1997

• 8    

  328 pages  

   

Volume price - $141.00  

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  • Preface

  • ABSTRACT

    The serial publication, Annual Review of Heat Transfer, focuses on new, important developments in the general field of heat transfer. As in the previous volumes, each chapter in the Annual Review deals with a significant, emerging topic by starting from fundamental physical considerations and then proceeding in a logical fashion to the forefront of recent developments and future challenges. The contributing authors are either young and upcoming, or well-established leaders in these emerging fields.
    A list of the topics covered in the last two volumes illustrates this special characteristic of the Annual Review. Volume 6 considered heat transfer topics in bio-optical imaging, ultrafine structures (aerogels), multi-phase modeling of alloy solidification, liquid jet impingement, interface measurements, CVD diamond layers, and molecular and microscale transport phenomena; Volume 7 contained excellent chapters on significant, but wide-ranging heat transfer research and developments in micro- and nano-scale optical and optoelectronic devices, growth of dendritic crystals, polymeric composite processing, active enhancement using electric fields, direct-contact transfer with droplets, clean-up of underground toxic wastes, and fluidized beds.
    Following this distinctive character, the present volume provides important contributions on heat transfer in microelectronics, Rayleigh-Benard convection, aerodynamics of flame surfaces, radiative transfer in non-isothermal inhomogeneous media, heat pipe analysis and simulation, and high heat flux spray cooling.
    The editor wishes to express his deep gratitude to the participating authors for their outstanding contributions, to Begell House for providing consistently excellent editorial assistance, and to the heat transfer community for its continuing support and input.

    ix pages



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