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Annals of the Assembly for International Heat Transfer Conference 13

 

ISBN 1-56700-225-0 / CD 1-56700-226-9

Volumes per year:

various

For Online Access


Year 2006

• Heat Exchangers    

DOI: 10.1615/IHTC13.p18    


  • FLAT MICRO HEAT PIPES FOR ELECTRONIC COOLING: AN ELABORATED MODEL OF THE HEAT TRANSFER
  • S. Tzanova
    Technical University of Sofia, Sofia, Bulgaria

    G. Angelov
    Technical University, Sofia, Bulgaria

    L. Kamenova
    Technical University, Sofia, Bulgaria

    Ch. Schaeffer
    Institut National Polytechnique, Grenoble, France


    ABSTRACT

    The vapour flow and heat transfer characteristics of flat micro heat pipes are analysed, proceeding from the model developed by A. Faghri. A new analytically derived expression for the friction factor-Reynolds number product is presented. The model is realized in Matlab; the ordinary differential equations are solved using the Runge-Kutta method. The simulated maximal dissipated power as a function of the heat input temperature given by the model is compared with other theoretical models and the experimental results of the Laboratoire d'Electrotechnique de Grenoble for copper and silicon prototypes.

    HEX-19 pages


    DOI: 10.1615/IHTC13.p18.190


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