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Annals of the Assembly for International Heat Transfer Conference 13

 

ISBN 1-56700-225-0 / CD 1-56700-226-9

Volumes per year:

various

For Online Access


Year 2006

• Materials Processing    

DOI: 10.1615/IHTC13.p11    


  • A 3D COMPUTATIONAL MODEL OF HEAT TRANSFER COUPLED TO PHASE CHANGE IN MULTILAYER MATERIALS WITH RANDOM CONTACTS
  • Graham de Vahl Davis
    University of NSW, Sydney, Australia

    M. Amara
    School of Mechanical and Manufacturing Engineering, The University of New South Wales, Sydney, NSW 2052, Australia; and SPCTS Laboratory, University of Limoges, 123 av. A. Thomas, 87060, Limoges cedex, France

    Victoria Timchenko
    University of New South Wales

    Mohammed El Ganaoui
    Université de Limoges, SPCTS UMR 6638 CNRS, France

    Eddie Leonardi
    Computational Fluid Dynamics Research Laboratory, School of Mechanical and Manufacturing Engineering, The University of New South Wales, Sydney, Australia 2052


    ABSTRACT

    An improved understanding of the heat transfer in materials consisting of two layers (deposit and substrate) is essential in a number of industrial applications. We are interested in the deposition, rapid cooling and solidification of metal droplets (known as splats) brought into contact with a cold substrate. We therefore need to understand the temperature history in both the deposit and the substrate, including phase change phenomena. A 3D model of the thermal contact resistance is developed; it allows for a random distribution of contact points rather than the uniform contact which is classically used. Phase change has been also included by using the enthalpy-porosity formulation. Simulations have been conducted using a commercial package CFX-4. The computational results for the cooling rate of the splat obtained using the random contact distribution model, are in good agreement with the experimental results. In addition, results obtained using the random model indicate inhomogeneity in the temperature at the interface between the splat and the substrate related to the response of the material to the random contact distribution.

    MPR-03 pages


    DOI: 10.1615/IHTC13.p11.30


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