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Hiroshi Takamatsu
Department of Mechanical Engineering, Kyushu University, Fukuoka 819-0395, Japan
Obtenha mais informações sobre o autor no Diretório de especialistas
Articles
HEAT TRANSFER AND LIQUID SOLID CONTACT DURING THE RAPID QUENCHING OF THIN WIRES IN WATER AND CaCI
2
/ WATER SOLUTION
Vol. 12 '1994
-
International Heat Transfer Conference 10
Effect of the size of micro-pin-fin on boiling heat transfer from silicon chips immersed in FC-72
Vol. 46 '2002
-
International Heat Transfer Conference 12
Engineering Approach to Irreversible Electroporation
Vol. 1 '2014
-
International Heat Transfer Conference 15
Observation of Ice-Solute Interaction in Freezing of Trehalose and Albumin Solutions by Using Confocal Raman Microscope Equipped with Directional Solidification Stage
Vol. 6 '2014
-
International Heat Transfer Conference 15
EFFECTIVE THERMAL RECTIFICATION IN SUSPENDED MONOLAYER GRAPHENE
Vol. 19 '2018
-
International Heat Transfer Conference 16
A DEVICE FOR MEASURING THERMAL CONDUCTIVITY WITH A DROP OF LIQUID
Vol. 24 '2018
-
International Heat Transfer Conference 16
Condensation of CFC-11 and HCFC-123 in In-Line Bundles of Horizontal Finned Tubes: Effect of Fin Geometry
Vol. 1 '1994
-
Journal of Enhanced Heat Transfer
Enhanced Boiling Heat Transfer from Silicon Chips with Micro-Pin Fins Immersed in FC-72
Vol. 10 '2003
-
Journal of Enhanced Heat Transfer
BOILING HEAT TRANSFER FROM A SILICON CHIP IMMERSED IN DEGASSED AND GAS-DISSOLVED FC-72: EFFECTED BY SIZE AND NUMBER DENSITY OF MICRO-REENTRANT CAVITIES
Vol. 24 '2017
-
Journal of Enhanced Heat Transfer
Effects of Size and Number Density of Micro-reentrant Cavities on Boiling Heat Transfer from a Silicon Chip Immersed in Degassed and Gas-dissolved FC-72
Vol. 6 '1999
-
Journal of Enhanced Heat Transfer
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