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Annual Reviews of Heat Transfer

ISSN 1049-0787

Individual price:

$175.00 (Must be sent to your home address)

You can order single issue or individual article. To purchase a single issue or an individual article as well as to view tables of contents and abstracts click on issue number.

Institutional price:

$349.00

Volumes per year:

various

Year 1999

288 pages

Volume price - $141.00

PREFACE

ABSTRACT

The tenth volume of the Annual Review of Heat Transfer completes a full decade of this successful serial publication and continues the fine tradition of reviewing and communicating new, important developments in the general field of heat transfer. Each chapter in the Annual Review deals with a significant, emerging topic by starting from fundamental physical considerations and then proceeding in a logical fashion to the forefront of recent developments and future challenges. The contributing authors are either young but upcoming, or well-established in these emerging fields.
This characteristic format of the Annual Review is well revealed by a list of the topics covered in the past two volumes: Volume 8 included reviews of such important topics as heat transfer in microelectronics, Rayleigh-Benard convection, aerodynamics of flame surfaces, radiative transfer in non-isothermal inhomogeneous media, heat pipe analysis and simulation, and high heat flux spray cooling. Volume 9 contained excellent chapters on significant, but wide-ranging heat transfer research developments in bioheat transfer, large scale radiative transport, radiative transfer in fibrous media, combustion in porous media, turbine blade coolant heat transfer, external flow film boiling, heat transfer in oscillatory flows, and two-dimensional annular flow.
Following these precedents, the present volume provides informative chapters on bioheat transfer and mass transfer modeling, plasma chemical thermophysics, theory and experiments on scattering, molecular dynamics in microscale, a review of turbulent heat transfer modeling, and the initiation and growth of solidification shrinkage voids.
For this volume and for the past decade of successful publication, the editor is deeply grateful to the participating authors for their excellent contributions, to Begell House for providing invaluable editorial assistance, and to the heat transfer community for its continuing support and input.