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Annual Reviews of Heat Transfer

 

ISSN 1049-0787

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$175.00 (Must be sent to your home address)
You can order single issue or individual article. To purchase a single issue or an individual article as well as to view tables of contents and abstracts click on issue number.

Institutional price:

$349.00

Volumes per year:

various

For Online Access


Year 2000

Volume 11    

  642 pages  

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Volume price - $141.00  

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  • Preface

  • ABSTRACT

    The eleventh volume of the Annual Review of Heat Transfer marks the beginning of this successful serial publication in the new millennium and continues with the fine tradition of reviewing and communicating new, important developments in the general field of heat transfer. The chapters presented in the past decade of the Annual Review deal with a significant, emerging topic by starting from fundamental physical considerations and then proceeding in a logical fashion to the forefront of recent developments and future challenges. The contributing authors are both young and well-established in these emerging fields.
    Volume 10 illustrated well this special characteristic of the Annual Review, providing informative chapters on bioheat and mass transfer modeling, plasma chemical thermophysics, radiation scattering from rough surfaces, molecular dynamics in microscale thermophysics, turbulent heat transfer modeling, and the initiation and growth of solidification shrinkage voids.
    To further illustrate the special characteristic of the Annual Review, the present volume provides new, emerging topics such as laser-liquid interactions, surface impacting of molten droplets, rapid solidification, nucleation and boiling in micro-structures, optical measurement of surface temperature, confined jet impingement, oscillatory convection and advanced heat exchangers with external fields.
    As we begin this volume in the new millennium, the editor is deeply grateful to the participating authors for their excellent contributions, to Begell House for providing invaluable editorial assistance, and to the heat transfer community for its continuing support and input. Thank you all of you for your dedication during the past decade.

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