Авторы, Редакторы, Рецензенты

Dimitrious E. Rapakoulias

Plasma Technology Lab, Dept. Chem. Engineering, University of Patras, P.O.Box 1407, 26500 Patra, Greece

Articles

IMPROVEMENTS IN CONTROL AND UNDERSTANDING OF RADIO FREQUENCY SILANE DISCHARGES Vol. 1 '1997 - High Temperature Material Processes: An International Quarterly of High-Technology Plasma Processes
INFLUENCE OF NEGATIVE SUBSTRATE BIAS ON PLASMA PROPERTIES AND SILICON FILM DEPOSITION RATE Vol. 11 '2007 - High Temperature Material Processes: An International Quarterly of High-Technology Plasma Processes
EFFECT OF INTERELECTRODE SPACE ON PROPERTIES OF SIH4/H2 DEPOSITION DISCHARGES OPERATING AT DIFFERENT RADIO FREQUENCIES Vol. 15 '2011 - High Temperature Material Processes: An International Quarterly of High-Technology Plasma Processes
ABOUT ROTATIONAL TEMPERATURE MEASUREMENTS AND THERMODYNAMIC EQUILIBRIUM IN RF GLOW DISCHARGES Vol. 3 '1999 - High Temperature Material Processes: An International Quarterly of High-Technology Plasma Processes
EFFECT OF INTERELECTRODE SPACE ON PROPERTIES OF SiH4/H2 DEPOSITION DISCHARGES OPERATING AT DIFFERENT RADIO FREQUENCIES Vol. 4 '2000 - High Temperature Material Processes: An International Quarterly of High-Technology Plasma Processes
TEOS/O2 GAS PRESSURE AS A CHEMICAL COMPOSITION ADJUSTER OF PLASMA DEPOSITED SIO2 THIN FILMS Vol. 9 '2005 - High Temperature Material Processes: An International Quarterly of High-Technology Plasma Processes
PLASMA PARAMETERS DERIVED FROM ELECTRICAL MEASUREMENTS IN RF PARALLEL PLATE ARGON GLOW DISCHARGES Vol. 1 '1997 - Progress in Plasma Processing of Materials, 1997
SPECIFIC PROBLEMS OF ROTATIONAL TEMPERATURE DETERMINATION IN PLASMAS OF MOLECULAR GASES Vol. 1 '1997 - Progress in Plasma Processing of Materials, 1997
EFFECT OF INTERELECTRODE SPACE ON PROPERTIES OF SiH4/H2 DEPOSITION DISCHARGES OPERATING AT DIFFERENT Vol. 0 '2001 - Progress in Plasma Processing of Materials, 2001
PLASMA DIAGNOSTICS FOR THE INVESTIGATION OF SILANE BASED GLOW DISCHARGE DEPOSITION PROCESSES Vol. 0 '2003 - Progress in Plasma Processing of Materials, 2003