Авторы, Редакторы, Рецензенты

C. Yuan

Centre for Device Thermography and Reliability, H.H. Wills Physics Laboratory, University of Bristol, UK
Больше информации об авторе - в Directory of Specialists

Articles

NUMERICAL SIMULATION OF HEAT TRANSFER ENHANCEMENT FOR COPPER FOAM HEAT SINK IN ELECTRONIC DEVICES USING WATER BASED BN NANOFLUIDS Vol. 10 '2018 - International Heat Transfer Conference 16