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Tetsuro Ogushi
Hiroshima International University; Lotus Thermal Solution, Inc., 1-1-3 Umeda, Kita-ku, Osaka 530-0001, Japan
Get more info about author from Directory of Specialists
Articles
Development of In-plane Thermal Conductivity Measurement Method of Multi-layer Printed Wiring Boards Called Straight Fin Temperature Fitting Method
Vol. 12 '2014
-
International Heat Transfer Conference 15
EFFECT OF THICKNESS AND PORE DIAMETER OF LOTUS-TYPE POROUS COPPER ON BREATHING PHENOMENON FOR IMPROVING HEAT TRANSFER PERFORMANCE OF SATURATED POOL BOILING
Vol. 9 '2023
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International Heat Transfer Conference 17
REVIEW OF COOLING OF ELECTRONIC EQUIPMENT
Vol. 1 '1994
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Journal of Enhanced Heat Transfer
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