Begell House作者，编辑及审稿者

J.W. Pomeroy

Centre for Device Thermography and Reliability, H.H. Wills Physics Laboratory, University of Bristol, UK
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Articles

NUMERICAL SIMULATION OF HEAT TRANSFER ENHANCEMENT FOR COPPER FOAM HEAT SINK IN ELECTRONIC DEVICES USING WATER BASED BN NANOFLUIDS Vol. 10 '2018 - International Heat Transfer Conference 16