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Compact Heat Exchangers and Enhancement Technology for the Process Industries - 2003

ISBN 打印: 978-1-56700-195-2

DEVELOPMENT OF A NEW HIGH DENSITY PACKAGE COOLING TECHNOLOGY USING LOW MELTING POINT ALLOYS

Abstract

This paper describes one of the new package cooling technology concept using a phase changing material (PCM) which would help develop high-density packaging. A low cost alloy, composed of Bi/Pb/Sn/In in which melting points of individual elements are less than 373 Kelvin, was used as the PCM. Thermal experiments using the above-mentioned alloy were carried out by the substrate back surface temperature could be fixed at the PCM's melting temperature for several minutes by thermal absorption, while the PCM phase changed from its original solid state into the liquid state. Also, in the present work, it has been confirmed that thermal network method is practically useful using a personal computer for the thermal design of a package with a PCM.
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