请登录 0 购物车
首页 图书 电子图书 期刊 参考文献及会议录 作者,编辑,审稿 A-Z 产品目录
Transport Phenomena in Thermal Engineering. Volume 2

ISBN 打印: 1-56700-015-0

THE EFFECT OF MODULE/BOARD INTERFACE THERMAL RESISTANCE ON COOLING OF AN AIR-COOLED MODULE

Abstract

The experiments were performed with a 31mm × 31mm × 7mm simulated module mounted on the floor of a parallel plate channel. The base wall is made of a 1mm thick copper plate. The conductive thermal resistance through the interface support, Rc, is thereby changed in three steps, namely, 0.02 K/W, 0.31K/W and 210K/W. Thermal conductance (UBB) of the board and convective thermal conductance (UA) from the module were derived, and the effect of Rc on UBB was investigated. It is found that the temperature of the module (TM) and the convective heat transfer ratio (QA/Q) depend on the thermal resistance of the connection layer The change of interface thermal resistance helps to elucidate the relative significance of heat transfer paths through the connection layer, the board, and from the board surface to the air.
首页 Begell Digital Portal Begell数据库 期刊 图书 电子图书 参考文献及会议录 作者,编辑,审稿 A-Z 产品目录 订购及政策 关于BegellHouse 联系我们 Language English 中文 Русский 日本語 Português Deutsch Français Español