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Transport Phenomena in Thermal Engineering. Volume 2

ISBN 打印: 1-56700-015-0

NATURAL CONVECTION HEAT TRANSFER FROM ELECTRONIC COMPONENTS LOCATED IN AN ENCLOSURE

Abstract

The problem of laminar natural convection cooling of electronic components located on a vertical substrate placed in a square enclosure filled with a fluid of Prandtl number equal to 0.71 corresponding to air is studied numerically. A commercially available general purpose CFD code, FLOW3D, was used to simulate the physical problem. Results have been obtained for a number of two dimensional geometries of realistic size conditions. The optional positions for the cooling of isothermal and constant heat flux plates are given.
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