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Transport Phenomena in Thermal Engineering. Volume 2

ISBN 打印: 1-56700-015-0

OPTIMAL GEOMETRY OF CONVECTION COOLED ELECTRONIC PACKAGES

Abstract

This is a review of a new class of fundamental results concerning the optimal spacing of parallel heat generating boards arranged in a stack of fixed volume. The cooling is by single-phase laminar flow, in natural convection or forced convection. Several board models will be considered: smooth boards with uniform temperature or uniform heat flux, flush mounted heat sources, protruding heat sources, and a board cooled in its own (insulated) parallel plate channel.
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