Boiling 2000 Phenomena and Emerging Applications Volume 2
ISBN 打印: 1-56700-148-3
Avram Bar-CohenLaboratory of the Thermal Management of Electronics, Department of Mechanical Engineering, University of Minnesota, Minneapolis, MN 55455, USA; Defense Advanced Research Projects Agency (DARPA), Microsystems Technology Office, University of Maryland, College Park, MD, USA
Gian Piero CelataENEA, Institute of Thermal Fluid Dynamics, ENEA TERM/ISP Heat Transfer Laboratory C.R.E.
James F. KlausnerDepartment of Mechanical and Aerospace Engineering, University of Florida
Yasunobu FujitaDepartment of Mechanical Engineering, Kyushu University, Hakozaki 6-10-1, Fukuoka, 812-8581, Japan