EFFECTS OF HIGH INTERFACIAL SHEAR STRESS DUE TO COUNTERCURRENT VAPOR FLOW ON FILM CONDENSATION HEAT TRANSFER

Gerner, Frank M.; Tien, Chang-Lin

Heat Pipe Technology: Volume 1. Fundamentals and Experimental Studies

ISSN Druckformat: 0-8493-9921-1

EFFECTS OF HIGH INTERFACIAL SHEAR STRESS DUE TO COUNTERCURRENT VAPOR FLOW ON FILM CONDENSATION HEAT TRANSFER

Frank M. Gerner Microscale Heat Transfer Laboratory, 692 Rhodes, University of Cincinnati, Cincinnati, Ohio 45221, USA

Chang-Lin Tien NEC Distinguished Professor of Engineering, Department of Mechanical Engineering, University of California, Berkeley, CA 94706, U.S.A.

Abstrakt

The heat transfer characteristics of a two-phase closed thermosyphon are experimentally investigated. Results indicate that, in the condenser, a large countercurrent vapor flow exerts a high interfacial shear stress upon the liquid film, which thickens the film and inhibits heat transfer. Both flat-plate and control-volume analyses predict similar results.

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