Heat Transfer & Transport Phenomena in Microscale
ISBN Print: 1-56700-150-5
THERMAL STRESS MODELING IN MICROELECTRONICS AND PHOTONICS PACKAGING
DOI: 10.1615/1-56700-150-5.560
pages 384-391
Abstrakt
The attributes of modeling of thermal stresses and strains in microelectronics and photonics packaging engineering are discussed, as well as the role that a probabilistic approach might play for understanding of the effect of the variability in materials properties, structural geometry and loading conditions on the thermal stress.
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