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Heat Transfer & Transport Phenomena in Microscale

ISBN Druckformat: 1-56700-150-5

THERMAL STRESS MODELING IN MICROELECTRONICS AND PHOTONICS PACKAGING

Abstrakt

The attributes of modeling of thermal stresses and strains in microelectronics and photonics packaging engineering are discussed, as well as the role that a probabilistic approach might play for understanding of the effect of the variability in materials properties, structural geometry and loading conditions on the thermal stress.
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