Kundenlogin 0 Einkaufswagen
Home Bücher eBücher Zeitschriften Referenzen und Berichte Autoren, Herausgeber, Rezensenten A – Z Produktindex
Transport Phenomena in Thermal Engineering. Volume 2

ISBN Druckformat: 1-56700-015-0

NATURAL CONVECTION HEAT TRANSFER FROM ELECTRONIC COMPONENTS LOCATED IN AN ENCLOSURE

Abstrakt

The problem of laminar natural convection cooling of electronic components located on a vertical substrate placed in a square enclosure filled with a fluid of Prandtl number equal to 0.71 corresponding to air is studied numerically. A commercially available general purpose CFD code, FLOW3D, was used to simulate the physical problem. Results have been obtained for a number of two dimensional geometries of realistic size conditions. The optional positions for the cooling of isothermal and constant heat flux plates are given.
Home Begell Digitales Portal Begell Digitale Bibliothek Zeitschriften Bücher eBücher Referenzen und Berichte Autoren, Herausgeber, Rezensenten A – Z Produktindex Preise und Aborichtlinien Über Begell House Kontakt Language English 中文 Русский 日本語 Português Deutsch Français Español