Heat Transfer & Transport Phenomena in Microscale
ISBN Imprimir: 1-56700-150-5
THERMAL STRESS MODELING IN MICROELECTRONICS AND PHOTONICS PACKAGING
Purchase PDF $35.00Sinopsis
The attributes of modeling of thermal stresses and strains in microelectronics and photonics packaging engineering are discussed, as well as the role that a probabilistic approach might play for understanding of the effect of the variability in materials properties, structural geometry and loading conditions on the thermal stress.
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ISBN En Línea: 978-1-56700-240-9
Thermal Radiation in Disperse Systems: An Engineering Approach
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