E. Suhir
Distinguished Member of Technical Staff Physical Sciences Research Division Bell Laboratories, Lucent Technologies, Inc.
600 Mountain Ave., Room ID-443, Murray Hill, NJ 07974, USA
Sinopsis
The attributes of modeling of thermal stresses and strains in microelectronics and photonics packaging engineering are discussed, as well as the role that a probabilistic approach might play for understanding of the effect of the variability in materials properties, structural geometry and loading conditions on the thermal stress.