Heat Transfer & Transport Phenomena in Microscale

ISBN Print: 1-56700-150-5

THERMAL STRESS MODELING IN MICROELECTRONICS AND PHOTONICS PACKAGING

DOI: 10.1615/1-56700-150-5.560
pages 384-391

Résumé

The attributes of modeling of thermal stresses and strains in microelectronics and photonics packaging engineering are discussed, as well as the role that a probabilistic approach might play for understanding of the effect of the variability in materials properties, structural geometry and loading conditions on the thermal stress.