Transport Phenomena in Thermal Engineering. Volume 2
ISBN Print: 1-56700-015-0
ASSESSMENT OF ELECTRONIC COOLING TECHNIQUES
DOI: 10.1615/ISTP-VI.690
pages 1207-1210
Resumo
The advent of LSI/VLSI systems, laser diode power optics and other advanced electronic systems in miniaturized, compact form have resulted in significant increases in heat flux
density. The stringent temperature
uniformity specifications on these systems demand innovative means of applying state-of-the art technology in enhancing heat removal.
Promising cooling techniques that will meet the future thermal control requirements for these electronic and optics packages are presented. These concepts involve the use of microchannel, droplet impingement, jet impingement, and flow boiling in straight or curved channels.
Promising cooling techniques that will meet the future thermal control requirements for these electronic and optics packages are presented. These concepts involve the use of microchannel, droplet impingement, jet impingement, and flow boiling in straight or curved channels.
Begell Recommend
Electrospinning of Micro- and Nanofibers: Fundamentals in Separation and Filtration Processes Y. FilatovA. Budyka
V. Kirichenko ISBN Imprimir: 978-1-56700-241-6
ISBN On-line: 978-1-56700-240-9
Thermal Radiation in Disperse Systems: An Engineering Approach Leonid A. Dombrovsky
Dominique Baillis ISBN Imprimir: 978-1-56700-268-3
ISBN On-line: 978-1-56700-351-2