The advent of LSI/VLSI systems, laser diode power optics and other advanced electronic systems in miniaturized, compact form have resulted in significant increases in heat flux
density. The stringent temperature
uniformity specifications on these systems demand innovative means of applying state-of-the art technology in enhancing heat removal.
Promising cooling techniques that will meet the future thermal control requirements for these electronic and optics packages are presented. These concepts involve the use of microchannel, droplet impingement, jet impingement, and flow boiling in straight or curved channels.