Transport Phenomena in Thermal Engineering. Volume 2

ISBN Print: 1-56700-015-0

NATURAL CONVECTION HEAT TRANSFER FROM ELECTRONIC COMPONENTS LOCATED IN AN ENCLOSURE

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DOI: 10.1615/ISTP-VI.600
pages 1157-1162

M. H. Esteki School of Mechanical & Manufacturing Engineering, The University of New South Wales, Kensington, Australia

John A. Reizes School of Mechanical and Manufacturing Engineering, UNSW-Sydney, Sydney 2052, Australia

Masud Behnia School of Mechanical and Manufacturing Engineering, University of New South Wales, Sydney 2052, Australia

Аннотация

The problem of laminar natural convection cooling of electronic components located on a vertical substrate placed in a square enclosure filled with a fluid of Prandtl number equal to 0.71 corresponding to air is studied numerically. A commercially available general purpose CFD code, FLOW3D, was used to simulate the physical problem. Results have been obtained for a number of two dimensional geometries of realistic size conditions. The optional positions for the cooling of isothermal and constant heat flux plates are given.

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