Авторы, Редакторы, Рецензенты

Ran Y. Kim

University of Dayton Research Institute, 300 College Park, Dayton, OH 45469-0168, USA
Больше информации об авторе - в Directory of Specialists

Articles

Construction of the Fiber-Matrix Interfacial Failure Envelope in a Polymer Matrix Composite Vol. 2 '2004 - International Journal for Multiscale Computational Engineering